Heat has been an issue in computing since the days of mainframes, when methods like water cooling were used to try to keep processors from melting. It remains a problem today, even though manufacturers have tried a range of possible solutions from complex fans and air cooling to massive heat sinks.
Bruno Michel, the manager for advanced thermal packaging, and his team are working on a procedure that uses a combination of techniques to find more effective cooling. The secret is all in the packaging--Michel's team is working on a chip package that puts a thermal paste directly on the processor and then attaches a heat sink that can dissipate some of the heat.
This picture shows a chip (at left) with thermal paste added and a copper heat dissipater attached. The liquid cooling attachment (at right) is also experimental.
Michel and his team are testing different pastes that can be used as adhesives for attaching processors and have great heat dissipation properties.
Talkback
More ZDNet Photo Galleries
Ultraportables
- Understanding Ultraportable Laptops (BNET)
- Five steps to protect mobile devices anywhere, anytime (TechRepublic)
- View all ZDNet Toshiba laptop reviews
- From our sponsors
- Toshiba Satellite® U400 Series
-
- The ultra-portable, ultra-stylish Satellite® U405 is a smart choice for you and your small business. Only from the laptop expert, Toshiba. Explore the complete laptop lineup »
-
