Heat has been an issue in computing since the days of mainframes, when methods like water cooling were used to try to keep processors from melting. It remains a problem today, even though manufacturers have tried a range of possible solutions from complex fans and air cooling to massive heat sinks.
Bruno Michel, the manager for advanced thermal packaging, and his team are working on a procedure that uses a combination of techniques to find more effective cooling. The secret is all in the packaging--Michel's team is working on a chip package that puts a thermal paste directly on the processor and then attaches a heat sink that can dissipate some of the heat.
This picture shows a chip (at left) with thermal paste added and a copper heat dissipater attached. The liquid cooling attachment (at right) is also experimental.
Michel and his team are testing different pastes that can be used as adhesives for attaching processors and have great heat dissipation properties.
Talkback
More ZDNet Photo Galleries
- Printers
- 'Green' Font Cuts Costs and Saves Trees (BNET)
- Three Ways to Save Paper (BNET)
- CNET Reviews printer buying guide (CNET)
- View all printers-tagged content on ZDNet
- Plan B from Brother
- It's the smarter way to work in color Our professional color ink-jet all-in-ones give you more choices, more features, and more value. Make the Smarter Choice. Learn More »
